Cu
Metallic copper single crystals (Cu) are widely used in matrix metals, alloy thin film materials and biomaterials.
| Performance and parameters | |
| Growth method | bridgman method |
| Crystal Structure | Face-centered cubic |
| Lattice Constant | a =3.607 Å |
| Purity | 99.9999% |
| Color and appearance | Yellow, orange |
| Crystal defect | Common crystal defects exist in artificial metal single crystals: tiny bubbles, surface pits and black spots |
| Density | 8.96g/cm3 |
| Melting Point | 1083℃ |
| Boiling Point | 2567℃ |
| Crystal Orientation | <100>、<110>、<111> |
| Redirection Precision | ±0.5° |
| Redirection the edge | ±1° |
Size | 20×20x1.0mm, 10×10x0.5mm, 10×5x0.5mm, 5×5x0.5mm, |
| Polishing | Single or double |
| Surface Roughness | about 30 Å |
| Packing | Class 1000 super clean room Class 100 super clean bag or single chip crystal box package |
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